LINTEC UV Wafer PO Film SUPPLIER

UV Wafer PO Film

Stokvis Tape is a global leader in manufacturing
precision die-cut component parts made of innovative adhesive materials

UV Wafer PO Film

UV Waffer PO Film prevents damage on wafer surface during back grinding and contamination caused by grinding fluid and/or debris. Adhesion of the tapes can be substantially decreased with UV irradiation, allowing easy peeling without stress on the wafer. This feature makes the series suitable for the processing of thin wafers


Technical Data

Backing thickness Backing Release Liner Peel Force (before UV) Peel Force (after UV) Elongation(%)
90μm~130μm PO PET film 1000gf/25mm 25gf/25mm MD:600% TD:600%


  • Any data provided relates to values typically generated when measuring these materials, and is offered as a guide to material selection. However it is not guaranteed and the user is responsible for evaluating the suitability of a product for the application it is intended for. Some test methods may vary, please refer to data sheet or call for assistance.


  • UV Wafer PO Film Characteristics

    High precision thickness accuracy ensures precision wafer thickness after back grinding
    Strong initial tack
    Loss adhesive after UV irradiation

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