2.0 W/mk Heat Sink Interface Material

2.0 W/mk Silicone Thermal Interface Material

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precision die-cut component parts made of innovative adhesive materials

2.0 W/mk Silicone Thermal Interface Material

2.0 W/mk Silicone Thermal Interface Material provides effective thermal interfaces between heat sinks and electronic devices where there are uneven surfaces, air gaps and rough surface textures. They offer high conformability to reduce interface resistance.2.0 W/mk gap filler provides a thixotropic one-part solution that is easily applied, remains conformable after application and does not flow during device operation to ensure that your thermal solution remains intact regardless of harsh operating conditions.

Technical Data

Thickness Color Thermal Conductivity Hardness Specific Gravity Service Temperature Breakdown Voltage Volume Resistivity Flamability Dielectric Constant
0.3~12mm Light Blue 2.0 W/m.k 20~40 Shore C 2.5 g/cm3 -40~+200℃ ≥4 KV 1.1*1016 UL-94 V-0 7.15 @1mhz

  • Any data provided relates to values typically generated when measuring these materials, and is offered as a guide to material selection. However it is not guaranteed and the user is responsible for evaluating the suitability of a product for the application it is intended for. Some test methods may vary, please refer to data sheet or call for assistance.

  • 2.0 W/mk Silicone Thermal Interface Material Characteristics

    Thermal Conductivity:2.0 W/m.k
    Thermal modules to heat sinks
    Highly conformable,low compression stress
    Compensate unevenness between PCB and heat sink
    For application with low contact pressure
    Tolerance adjustment of multible components